Micromax 5771 Gold Conductor

AIRUFU (Shanghai) New Materials Technology Co., Ltd.
Extreme Environment Resistance: It features excellent corrosion and oxidation resistance, capable of withstanding humidity, acid-base, and other environmental impacts. It maintains stable performance in high-temperature automotive environments or long-term use of medical equipment. Additionally, the gold-based composition inherently has low migration, eliminating short-circuit risks.
Low-Temperature Efficient Curing: It enables rapid curing at 150℃-200℃, much lower than the temperature required for traditional tin-lead soldering. This effectively avoids thermal damage and internal stress of precision components like chips caused by high temperatures, improving production efficiency while ensuring yield.
Broad Compatibility and Strong Adhesion: It boasts strong adhesion to various substrates such as ceramics, glass, and polymer films, preventing poor contact after bonding. Meanwhile, it is compatible with flexible substrates, maintaining stable connections in frequently bent flexible printed circuits (FPCs).
Stable Low-Impedance Conduction: Containing high-purity gold-based conductive components, it forms a dense conductive network. After bonding, it exhibits excellent impedance stability with minimal performance fluctuation before and after reliability tests, meeting high-frequency signal transmission requirements, especially for fine circuits in 5G communications and IC packaging.
Precision Electronic Packaging: Acting as a key conductive medium in the interconnection between IC chips and substrates, it can be accurately coated to form reliable bonding points in flip-chip packaging, ensuring efficient signal transmission of chips.