Celanese’s Micromax 5771 Gold Conductor is a premium thick-film gold paste engineered for reliable gold wire bonding. Tailored for precision electronic interconnection, it delivers consistent performance across consumer electronics, automotive, and medical sectors—backed by 60+ years of the brand’s material innovation expertise.
Core Advantages: Engineered for Gold Wire Bonding
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Extreme Environment Resistance – Delivers exceptional corrosion/oxidation resistance, withstanding humidity (RH 85%+), acid-base exposure, and temperature fluctuations (-40℃ to 150℃). Maintains stability in high-heat automotive cabins and critical medical devices (e.g., ECG monitors) during long-term use. Gold-based formulation ensures low ion migration, eliminating short-circuit risks.
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Low-Temp Rapid Curing – Cures fully in 10-15 mins at 150℃-200℃ (vs. 250℃+ for tin-lead soldering). Reduces thermal stress on chips and fragile components, cutting rework rates by 18%+ while boosting production throughput.
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Broad Compatibility & Strong Adhesion – Bonds securely to ceramics, glass, polymer films, and flexible substrates. Pull-off strength reaches 15 N/mm2 (ASTM D1002), ensuring stable connections in frequently bent FPCs (e.g., smartphone flexible screens).
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Stable Low-Impedance Conduction – 99.9% pure gold content forms a dense conductive network. Post-bonding impedance (≤0.01Ω/sq) fluctuates by <2% after 1,000-hour reliability testing, meeting 5G high-frequency (28GHz+) and IC packaging demands.
Key Applications
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【Semiconductor & IC】 Flip-chip packaging: Acts as a conductive medium for IC chip-substrate interconnection, forming precise bonding points to ensure 99.9% signal transmission efficiency.
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【Automotive Electronics】 Central control screens, instrument panels: Withstands vibration (10-2000Hz) and high temps, ideal for ADAS sensor circuit bonding.
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【Medical Devices】 Implantable devices, diagnostic equipment: Biocompatible (ISO 10993) and corrosion-resistant, supporting long-term in-vivo/in-vitro use.
Practical Guidelines for Usage & Procurement
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Process Matching: Viscosity (100-150 Pa·s) suits screen printing/stencil printing; recommended film thickness: 5-20μm for optimal bonding.
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Storage Requirements: 6-month shelf life when sealed, stored at 15-25℃ (RH ≤ 50%); avoid repeated freezing-thawing.
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Procurement Tips: Authorized agents in East China provide original packaging; request COA/SGS reports. Pre-production sampling is recommended to match substrate types (e.g., alumina ceramic vs. PI film).
Micromax 5771 balances reliability, efficiency, and compatibility—making it a cost-effective choice to streamline gold wire bonding processes and reduce field failure rates.
